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Chemical Industry

CAMERA MODULE ADHESIVE_EE-DA SERIES

FAST THERMAL CURABLE ADHESIVE

  • High Adhesion strength
  • Low Temperature Fast Cure ( ≥80 ℃)
  • Low thermal expansion coefficient
  • High Reliability

TYPICAL PROPERTIES

  • Brookfield DV2T, #51 20,000±1,000 @5rpm
  • TI3.5 @ɳ0.5rpm/ɳ5rpm
  • HardnessShore D 83
  • Tg(℃)54oC by TMA
  • CTE(ppm/oC, RT-300oC) 48 @ <Tg, 121 @ >Tg
  • Lap Shear Strength≥ 23MPa (Glass Epoxy/Glass Epoxy)
  • Shelf life At < 25℃≥ 3 days
  • Shelf life At < -15℃6 months

TYPICAL CURING PERFORMANCE

  • Heat≥ 70℃ × 3min