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Chemical Industry

Chemical Industry

CAMERA MODULE ADHESIVE_EE-DA SERIES

FAST THERMAL CURABLE ADHESIVE

  • Low Temperature Fast Cure (≥60 ℃)
  • High Shear strength
  • Low thermal expansion coefficient
  • Low-outgassing

TYPICAL PROPERTIES

  • Brookfield DV2T, #51 14,000±3,000 @5rpm
  • TI3.78 @ɳ0.5rpm/ɳ5rpm
  • HardnessShore D 80
  • Tg(℃)47 (DSC)
  • CTE(ppm/oC, RT-300oC) 100.6 @ <Tg
  • Lap Shear Strength≥ 8MPa (PCB/Si wafer, PCB/SUS) @2mg
  • Shelf life At < 25℃≥ 3 days
  • Shelf life At < -15℃6 months

TYPICAL CURING PERFORMANCE

  • Heat≥ 70℃ × 3min