PRODUCT
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Proposal
Application
- Treatment of PFCs gases such as CF4 and SF6 generated in semiconductor etching processes
- Treatment of PFCs gases generated from various chemical industry manufacturing processes
Benefits
- Efficiency improvement and reduction of trouble through load distribution processing
- High energy efficiency (recovery rate of 70% or higher)
- Simultaneous minimization of dust emissions during PFCs treatment
- Economical technology in terms of operation and maintenance
- Removing catalyst poison during the pre-treatment process to improve catalyst processing performance and extend its lifespan
Background
- Excessive energy and investment costs are required to treat the waste gas (CxFy series) from the etching process
- ※ CxFy Gas requires a high temperature of at least 1,300℃ for thermal decomposition
- Insufficient installation space due to multiple POU scrubbers
- The secondary treatment cost is incurred due to greenhouse gases such as NOx generated from by-products